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September 7, 2005
By: Greg Hrinya
Cham Paper to sponsor 7th global symposium The 7th International Cham Paper Group Symposium for the Flexible Packaging Industry will take place September 8-9 in Bern, Switzerland. This year’s theme is “Paper Naturally Intelligent.” The sponsor is Cham-Tenero Paper Mills, of Cham, Switzerland. Among topics presented will be the impacts of RFID and nanotechnology on the packaging of tomorrow; market trends and statistics from Eastern Europe, and metallic ink technology. Among the speakers will be representatives of Nestlé, Eckart, Hueck Foils, Unilever, PIRA, and South African Breweries. The symposium will take place in The Bellevue Palace Hotel. For information, visit www.champaper.com, or contact Alison Gustavsson by telephone at 41-41-785-3164, or by e-mail at [email protected].
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